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Width 18
Depth 78
Height 8.45
Compatible Brand Huawei
Description 10G BASE-LR Small Form-factor Pluggable (XFP)
Connector Type Dual SC Connector
Data Link Protocol Gigabit Ethernet
Cabling Type Singlemode Fibre (SMF)
Data Transfer Rate 10 Gb/s
Max Transfer Distance upto 10km
Transmitter Wavelength 1310nm
Form Factor XFP
Max Operating Temperature 70
Direct Attach Cables N/A
Cable Assembly Datarate N/A
Cable Assembly Length N/A
Cable Assembly Type N/A

XFP-STM64-LX-SM1310 (10G BASE-LR XFP) Datasheet


  • Supports 9.95Gb/s to 11.1Gb/s bit rates
  • Hot-pluggable XFP footprint
  • Maximum link length of 10km with SMF
  • 1310nm uncooled DFB laser
  • XFP MSA package with duplex LC connector
  • No reference clock required
  • +1.8V,+3.3V Supply Voltage
  • XFI and lineside loopback Mode Supported
  • -5ºC to 70ºC Operating Case Temperature
  • Diagnostic Performance Monitoring of module temperature,
  • Supply Voltages, laser bias current, transmit optical power, and receive optical power
  • RoHS6 compliant (lead free)


  • 10GBASE-LR at 10.3125Gbps
  • Other optical links,up to 11.1Gbps


The SX-31192-LRC is compliant with the 10G Small Form-Factor Pluggable (XFP) Multi-Source Agreement (MSA), supporting data-rate of 10.3125Gbps(10GBASE-LR) or 9.953Gbps 10GBASE-LW), and transmission distance up to 10km on SMF. The transceiver module comprises of a transmitter with a 1310nm Uncooled DFB laser and a receiver with a PIN photodiode. Transmitter and receiver are separate within a wide temperature range of 0℃ to +70℃ and offers optimum heat dissipation and excellent electromagnetic shielding thus enabling high port densities for 10G systems.

Absolute Maximum Ratings

Parameter Symbol Min Max Unit
Supply Voltage3 Vcc1 -0.5 4.0 V
Supply Voltage 2 Vcc2 -0.5 2 V
Storage Temperature Tst -40 85 ºC
Case Operating Temperature Top -5 70 ºC


Electrical Characteristics

Parameter Symbol Min Typical Max Unit Note
Operating Case Temperature Range Tc 0   +70  
Power Supply Voltage @ 3.3V Vcc3 3.13 3.3 3.47 V  
Module total power P     2.5 W  
Input differential impedance Rin   100   1
Differential data input swing Vin,pp 120   820 mV  
Transmit Disable Voltage VD 2.0   Vcc V  
Transmit Enable Voltage VEN GND   GND+0.8 V  
Transmit Disable Assert Time       10 us  
Differential data output swing Vout,pp 500   850 mV  
Data output rise time tr     40 ps 2
Data output fall time tf     40 ps 2
LOS Fault VLOS fault Vcc - 0.5   VccHOST V 3
LOS Normal VLOS norm GND   GND+0.5 V 3
Power Supply Rejection PSR See Note 3 below   4


  1. After internal AC coupling.
  2. 20 – 80 %
  3. Loss Of Signal is open collector to be pulled up with a 4.7k – 10kohm resistor to 3.15 – 3.6V. Logic 0 indicates normal operation; logic 1 indicates no signal detected.
  4. Per Section 2.7.1. in the XFP MSA Specification.

Optical Characteristics

Parameter Symbol Min Typical Max Unit Ref.
Optical output Power P -6.5   +0.5 dBm  
Optical Wavelength λ 1260   1355 nm  
Optical Extinction Ratio ER 6     dB 1
Side Mode Suppression Ratio SMSR 30     dB  
Average Launch power of OFF transmitter POFF -30     dBm  
Tx Jitter Txj Compliant with each standard requirements  
Receiver Sensitivity RSENS     -15 dBm 2
Receiver Sensitivity in OMA RSENS     -12.5 dBm 2
Maximum Input Power PMAX +0.5     dBm  
Optical Center Wavelength λC 1260   1600 nm  
LOS De-Assert LOSD     -15 dBm  
LOS Assert LOSA -25     dBm  
LOS Hysteresis   1   4 dB  

Notes: 1, PRBS 231-1 test pattern @10.3125Gbps. 2, PRBS 231-1 test pattern @10.3125Gbps, BER≤10-12.

Pin Descriptions

Pin Logic Symbol Name/Description Ref
1   GND Module Ground 1
2   VEE5 Optional –5.2 Power Supply – Not required  
3 LVTTL-I Mod-Desel Module De-select; When held low allows the module to  , respond to 2-wire serial interface commands  
4 LVTTL-O Interrupt Interrupt (bar); Indicates presence of an important condition which can be read over the serial 2-wire interface 2
5 LVTTL-I TX_DIS Transmitter Disable; Transmitter laser source turned off  
6   VCC5 +5 Power Supply – Not required  
7   GND Module Ground 1
8   VCC3 +3.3V Power Supply  
9   VCC3 +3.3V Power Supply  
10 LVTTL-I SCL Serial 2-wire interface clock 2
11 LVTTL-  I/O SDA Serial 2-wire interface data line 2
12 LVTTL-O Mod_Abs Module Absent; Indicates module is not present. Grounded in the module. 2
13 LVTTL-O Mod_NR Module Not Ready; 2
14 LVTTL-O RX_LOS Receiver Loss of Signal indicator 2
15   GND Module Ground 1
16   GND Module Ground 1
17 CML-O RD- Receiver inverted data output  
18 CML-O RD+ Receiver non-inverted data output  
19   GND Module Ground 1
20   VCC2 +1.8V Power Supply  
21 LVTTL-I P_Down/RST Power Down; When high, places the module in the low power stand-by mode and on the falling edge of P_Down initiates a module reset  
Reset; The falling edge initiates a complete reset of the module including the 2-wire serial interface, equivalent to a power cycle.  
22   VCC2 +1.8V Power Supply  
23   GND Module Ground 1
24 PECL-I RefCLK+ Reference Clock non-inverted input, AC coupled on the host board – Not required 3
25 PECL-I RefCLK- Reference Clock inverted input, AC coupled on the host board – Not required 3
26   GND Module Ground 1
27   GND Module Ground 1
28 CML-I TD- Transmitter inverted data input  
29 CML-I TD+ Transmitter non-inverted data input  
30   GND Module Ground 1


  1. Module circuit ground is isolated from module chassis ground within the module.
  2. Open collector; should be pulled up with 4.7k – 10k ohms on host board to a voltage between 3.15Vand 3.6V.
  3. A Reference Clock input is not required.

Electrical Pin-out Details  

10G BASE-LR XFP-elect-pins

Mechanical Specifications  

10G BASE-LR XFP-mech-spec

XFP Mechanical Components  

10G BASE-LR XFP-mech-comp

The mechanical components defined:

  1. The module, clip and connector dimensions are constant for all applications. While the bezel, cage assembly, EMI gasket and heat sink can be designed and/or adjusted for the individual application.
  2. The relatively small form factor of the XFP module combined with an adaptable heatsink option allows host system design optimization of module location, heatsink shape/dimension/fins design, and airflow control. The module can be inserted and removed from the cage with the heat sink and clip attached.


Regulatory Compliance

The compatible XFP transceiver is designed to be Class I Laser safety compliant and is certified per the following standards:  

Feature Standard
Laser Safety CDRH 21 CFR 1040 and Laser Notice No. 50
Product Safety UL and CUL EN60950-2:2007
Environmental protection RoHS Directive 2002/95/EC
EMC EN 55022:2006+A1:2007 EN 55024:1998+A1+A2:2003 -



  1. 10 Gigabit Small Form Factor Pluggable Module (XFP) Multi-Source Agreement (MSA), Rev 4.5 – August 2005. Documentation is currently available at
  2. 3ae – 2002
  3. ITU-T G.709 / ITU-T G.959.1
  4. Telcordia GR-253-CORE

Important Notice

Performance figures, data and any illustrative material provided in this datasheet are typical and must be specifically confirmed in writing by SFP Modules before they become applicable to any particular order or contract. In accordance with the SFP Modules policy of continuous improvement specifications may change without notice. The publication of information in this datasheet does not imply freedom from patent or other protective rights of SFP Modules or others. Further details are available by emailing

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